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 Exploring Density-Reliability Tradeoffs on Nanoscale Substrates: When do smaller less reliable devices make sense?
Andrey Zykov, Gustavo de Veciana

Citation
Andrey Zykov, Gustavo de Veciana. "Exploring Density-Reliability Tradeoffs on Nanoscale Substrates: When do smaller less reliable devices make sense?". The 23rd IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT'08), September, 2008.

Abstract
It is widely recognized that device and interconnect fabrics at the nanoscale will be characterized by an increased susceptibility to transient faults. This appears to be intrinsic to nanoscale regimes and fundamentally limits the eventual benefits of the increased device density, i.e., the overheads associated with achieving fault-tolerance may counter the benefits of increased device density. density-reliability tradeoff. At the same time, as devices scale down one can expect a higher proportion of area to be associated with interconnection, i.e., area is wire dominated. This paper theoretically explores density-reliability tradeoffs in wire dominated integrated systems. We derive an area scaling model based on simple assumptions capturing the salient features of hierarchical design for high performance systems. We then evaluate overheads associated with using basic fault-tolerance techniques at different levels of the design hierarchy. This, albeit simplified model, allows us to tackle several interesting questions: When does it make sense to use smaller less reliable devices? At what scale of the design hierarchy should fault tolerance be applied in high performance integrated systems? Our analysis reveals two critical parameters, the technology and design scaling factors, which are key to predicting the reliability requirements for emerging technologies if traditional hierarchical design continues to be used.

Electronic downloads

Citation formats  

  • HTML
    Andrey Zykov, Gustavo de Veciana. <a
    href="http://www.gigascale.org/pubs/1337.html">Exploring
    Density-Reliability Tradeoffs on Nanoscale Substrates: When
    do smaller less reliable devices make sense?</a>, The
    23rd IEEE International Symposium on Defect and Fault
    Tolerance in VLSI Systems (DFT'08), September, 2008.
  • Plain text
    Andrey Zykov, Gustavo de Veciana. "Exploring
    Density-Reliability Tradeoffs on Nanoscale Substrates: When
    do smaller less reliable devices make sense?". The 23rd IEEE
    International Symposium on Defect and Fault Tolerance in
    VLSI Systems (DFT'08), September, 2008.
  • BibTeX
    @inproceedings{ZykovdeVeciana08_ExploringDensityReliabilityTradeoffsOnNanoscaleSubstrates,
        author = {Andrey Zykov and Gustavo de Veciana},
        title = {Exploring Density-Reliability Tradeoffs on
                  Nanoscale Substrates: When do smaller less
                  reliable devices make sense?},
        booktitle = {The 23rd IEEE International Symposium on Defect
                  and Fault Tolerance in VLSI Systems (DFT'08)},
        month = {September},
        year = {2008},
        abstract = {It is widely recognized that device and
                  interconnect fabrics at the nanoscale will be
                  characterized by an increased susceptibility to
                  transient faults. This appears to be intrinsic to
                  nanoscale regimes and fundamentally limits the
                  eventual benefits of the increased device density,
                  i.e., the overheads associated with achieving
                  fault-tolerance may counter the benefits of
                  increased device density. density-reliability
                  tradeoff. At the same time, as devices scale down
                  one can expect a higher proportion of area to be
                  associated with interconnection, i.e., area is
                  wire dominated. This paper theoretically explores
                  density-reliability tradeoffs in wire dominated
                  integrated systems. We derive an area scaling
                  model based on simple assumptions capturing the
                  salient features of hierarchical design for high
                  performance systems. We then evaluate overheads
                  associated with using basic fault-tolerance
                  techniques at different levels of the design
                  hierarchy. This, albeit simplified model, allows
                  us to tackle several interesting questions: When
                  does it make sense to use smaller less reliable
                  devices? At what scale of the design hierarchy
                  should fault tolerance be applied in high
                  performance integrated systems? Our analysis
                  reveals two critical parameters, the technology
                  and design scaling factors, which are key to
                  predicting the reliability requirements for
                  emerging technologies if traditional hierarchical
                  design continues to be used.},
        URL = {http://www.gigascale.org/pubs/1337.html}
    }
    

Posted by Andrey Zykov on 26 Jul 2008..

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