Search: 
 
Commands
  Search pubs database

Quick search by ...
Theme
  alternative
concurrent
core
resilient
heterogeneous
infrastructure
microarch
power
reliable
roadmap
self_test
soft
verification

Design Driver
  driver
ambient
gateway
Year
  2009
2008
2007
2006
2005
2004
2003
2002
2001
2000
1999
1998


Group
  2006faculty
bee2
bk_partitioning
bk_placement
bk_routing
bookshelf
embedded
fabricsthrust
faculty
fresco
gsrc
gsrcadmin
gsrc_faculty
gtx
infrax
marcov
mescal
metropolis
nexsis
polis
ptolemy
semantics
sig_modeling
sig_power
sig_uarch
sig_verification
testthrust
theme_leaders
 Impact of Process and Temperature Variations on Network-on-Chip Design Exploration
Bin Li, Li-Shiuan Peh, Priyadarsan Patra

Citation
Bin Li, Li-Shiuan Peh, Priyadarsan Patra. "Impact of Process and Temperature Variations on Network-on-Chip Design Exploration". IEEE International Symposium on Networks-on-Chip, April, 2008.

Abstract
With the continuing scaling of CMOS technologies, process variation is becoming a key factor highly impacting system-level power and temperature. Traditional methods of assuming a uniform temperature and no process variation can lead to gross inaccuracies even for system-level design, thus it is critical to consider the effects of process variation and temperature variation during early design exploration. In this paper, we describe the implementation of an architecture-level early-stage design space exploration tool that incorporates the effect of process and temperature variation for Network-on-chips(NoC). The tool is used to study the impact of process and temperature variations on power and energy-delay-product-per-flit metrics for different NoC architectures, and our simulation results show that design choices are influenced by the effects of process and temperature variation, thus demonstrating the importance of considering, and enabling the high-level impact analysis of process and temperature variation early in the design flow.

Electronic downloads
Confidential. This publication has been marked by the author for GSRC-only distribution, so electronic downloads are not available without logging in.

Citation formats  

  • HTML
    Bin Li, Li-Shiuan Peh, Priyadarsan Patra. <a
    href="http://www.gigascale.org/pubs/1288.html">Impact
    of Process and Temperature Variations on Network-on-Chip
    Design Exploration</a>, IEEE International Symposium
    on Networks-on-Chip, April, 2008.
  • Plain text
    Bin Li, Li-Shiuan Peh, Priyadarsan Patra. "Impact of Process
    and Temperature Variations on Network-on-Chip Design
    Exploration". IEEE International Symposium on
    Networks-on-Chip, April, 2008.
  • BibTeX
    @inproceedings{LiPehPatra08_ImpactOfProcessTemperatureVariationsOnNetworkonChip,
        author = {Bin Li and Li-Shiuan Peh and Priyadarsan Patra},
        title = {Impact of Process and Temperature Variations on
                  Network-on-Chip Design Exploration},
        booktitle = {IEEE International Symposium on Networks-on-Chip},
        month = {April},
        year = {2008},
        abstract = {With the continuing scaling of CMOS technologies,
                  process variation is becoming a key factor highly
                  impacting system-level power and temperature.
                  Traditional methods of assuming a uniform
                  temperature and no process variation can lead to
                  gross inaccuracies even for system-level design,
                  thus it is critical to consider the effects of
                  process variation and temperature variation during
                  early design exploration. In this paper, we
                  describe the implementation of an
                  architecture-level early-stage design space
                  exploration tool that incorporates the effect of
                  process and temperature variation for
                  Network-on-chips(NoC). The tool is used to study
                  the impact of process and temperature variations
                  on power and energy-delay-product-per-flit metrics
                  for different NoC architectures, and our
                  simulation results show that design choices are
                  influenced by the effects of process and
                  temperature variation, thus demonstrating the
                  importance of considering, and enabling the
                  high-level impact analysis of process and
                  temperature variation early in the design flow.},
        URL = {http://www.gigascale.org/pubs/1288.html}
    }
    

Posted by Bin Li on 22 Apr 2008..

Notice: This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright.

 
You are not logged in
©1998-2008 GSRC